University Students Design Innovative CPU Heat Sinks

Check out this month's sneak-peak editorial from the Sept. 2019 issue of Manufacturing Engineering magazine:

Digital Manufacturing Challenge: Powering the World by an Innovative Design for CPU Heat Sinks 

During SME’s RAPID TCT Manufacturing Poster Challenge, two University of Waterloo students — Lisa Brock and Gitanjali Shanbhag — showcased their winning Digital Manufacturing Challenge submission, “The Copper Cooler: Heat Sink for CPUs.”

EXCERPT: 

"ENERGY AND THE WORK IT CAN DO are fundamental to powering our world. Harnessing energy through its generation or conversion, transfer and storage is often accompanied by heat. SME’s 2019 Digital Manufacturing Challenge emphasized the thermal management or temperature control of systems, processes or devices that generate, convert and transfer or store energy. The journey from entering the competition to becoming the overall winner for our innovative design has brought us immense excitement and interest to generate new ideas in this space."
2f255aa3a84bacffe5a0209d455fa05c-huge-20From left: Mihaela Vlasea, PhD, University of Waterloo, Waterloo, Ontario, and an advisor for SME’s Additive Manufacturing Community; Carl Dekker, Met-l-flo Inc., Sugar Grove, Ill., and chair of SME’s Direct Digital Manufacturing Tech Group; 2019 winners Lisa Brock, a master’s degree student in Mechanical and Mechatronics Engineering in the Multi-Scale Additive Manufacturing Lab at the University of Waterloo, and Gitanjali Shanbhag, a doctorate student in Mechanical and Mechatronics Engineering in the Multi-Scale Additive Manufacturing Lab at the University of Waterloo; and Jennifer Fielding, PhD, Air Force Research Laboratory, Liberty Township, Ohio, and the former chair of SME’s Additive Manufacturing Community.
Posted by Dianna Helka on Aug 27, 2019 3:46 PM America/New_York